Copoly(imide-amides) containing hexafluoroisopropylideneThe incorporation of the hexafluoroisopropylidene (HFIP or 6F) group into polymer backbones brings about important and useful changes in properties. These differences include increased thermal and environmental resistance and solubility and decreased dielectric constant and color. Several types of backbones have been substrates for the inclusion of HFIP and all results have reflected impressive property benefits. This project involved the incorporation of 6F groups into a poly(imide-amide) backbone by the condensation of a 6F-containing dianhydride with 4-aminobenzoic acid to yield a diimide terminated with two carboxylic acid groups. This diacid trimer was then polymerized with various diamines. The polymers were obtained in yields of 86-94 percent and with viscosities of 0.90-2.26 dL/g. They were stable to above 500 C and clear, colorless films could be cast from DMAc.
Document ID
19920027695
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Irvin, David J. (Southwest Texas State Univ. San Marcos, TX, United States)
Cassidy, Patrick E. (Southwest Texas State Univ. San Marcos, TX, United States)
Cameron, Mitch L. (Southwest Texas State University San Marcos, TX, United States)
Date Acquired
August 15, 2013
Publication Date
January 1, 1990
Subject Category
Nonmetallic Materials
Meeting Information
Meeting: International SAMPE Electronic Materials and Processes Conference