High-performance packaging for monolithic microwave and millimeter-wave integrated circuitsPackaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.
Shalkhauser, K. A. (NASA Lewis Research Center Cleveland, OH, United States)
Li, K. (NASA Lewis Research Center Cleveland, OH, United States)
Shih, Y. C. (Hughes Aircraft Co., Microelectronic Circuits Div., Torrance CA, United States)