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Addition Curing Thermosets Endcapped with 4-Amino (2.2) ParacyclophaneA new family of addition curing polyimides were prepared that contained 4-amino (2.2)-paracyclophane as the endcap. An improved synthesis of the endcap 4-amino-(2.2) cyclophane was accomplished increasing the yield to 60 percent and simplifying the procedure. DSC and rheological analysis of endcapped polyimide oligomers confirmed that the onset for polymerization of the ethylene bridge was 250 C. C-13 CP/MAS NMR was used to determine the structural changes of the oligomers after thermal treatment. The cyclophane capped polyimides were successfully compression molded to form void free neat resin specimens. Tg's as high as 353 C were obtained by thermomechanical analysis for postcured samples. Preliminary thermal stability studies suggest that these resins have a high onset of decomposition ranging from 549 to 567 C.
Document ID
19920051294
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Waters, John F.
(Case Western Reserve University Cleveland, OH, United States)
Sutter, James K.
(NASA Lewis Research Center Cleveland, OH, United States)
Meador, Mary A. B.
(NASA Lewis Research Center Cleveland, OH, United States)
Baldwin, Larry J.
(NASA Lewis Research Center Cleveland, OH, United States)
Meador, Michael A.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
August 15, 2013
Publication Date
January 1, 1991
Publication Information
Publication: Journal of Polymer Science, Part A - Polymer Chemistry
Volume: 29
ISSN: 0887-624X
Subject Category
Nonmetallic Materials
Report/Patent Number
E-5509
Accession Number
92A33918
Distribution Limits
Public
Copyright
Other

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