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Two-dimensional thermal modeling of power monolithic microwave integrated circuits (MMIC's)Numerical simulations of the two-dimensional temperature distributions for a typical GaAs MMIC circuit are conducted, aiming at understanding the heat conduction process of the circuit chip and providing temperature information for device reliability analysis. The method used is to solve the two-dimensional heat conduction equation with a control-volume-based finite difference scheme. In particular, the effects of the power dissipation and the ambient temperature are examined, and the criterion for the worst operating environment is discussed in terms of the allowed highest device junction temperature.
Document ID
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
External Source(s)
Fan, Mark S.
(Maryland, University, College Park; NASA, Goddard Space Flight Center Greeenbelt, United States)
Christou, Aris
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Pecht, Michael G.
(Maryland, University College Park, United States)
Date Acquired
August 15, 2013
Publication Date
May 1, 1992
Publication Information
Publication: IEEE Transactions on Electron Devices
Volume: 39
Issue: 5, Ma
ISSN: 0018-9383
Subject Category
Electronics And Electrical Engineering
Accession Number
Distribution Limits

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