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Record Details

Record 16 of 6253
Low coefficient of thermal expansion polyimides containing metal ion additives
Author and Affiliation:
Stoakley, D. M.(NASA Langley Research Center, Hampton, VA, United States)
St. Clair, A. K.(NASA Langley Research Center, Hampton, VA, United States)
Abstract: Polyimides have become widely used as high performance polymers as a result of their excellent thermal stability and toughness. However, lowering their coefficient of thermal expansion (CTE) would increase their usefulness for aerospace and electronic applications where dimensional stability is a requirement. The incorporation of metal ion-containing additives into polyimides, resulting in significantly lowered CTE's, has been studied. Various metal ion additives have been added to both polyamic acid resins and soluble polyimide solutions in the concentration range of 4-23 weight percent. The incorporation of these metal ions has resulted in reductions in the CTE's of the control polyimides of 12 percent to over 100 percent depending on the choice of additive and its concentration.
Publication Date: Jul 01, 1992
Document ID:
19920067196
(Acquired Nov 22, 1995)
Accession Number: 92A49820
Subject Category: NONMETALLIC MATERIALS
Document Type: Journal Article
Publication Information: SAMPE Quarterly (ISSN 0036-0821); 23; 4, Ju
Publisher Information: United States
Financial Sponsor: NASA; United States
Organization Source: NASA Langley Research Center; Hampton, VA, United States
Description: 5p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: ADDITIVES; POLYIMIDES; POLYMERIC FILMS; THERMAL EXPANSION; THERMAL STABILITY; GLASS TRANSITION TEMPERATURE; MOLECULAR STRUCTURE; RARE EARTH ELEMENTS
Imprint And Other Notes: SAMPE Quarterly (ISSN 0036-0821), vol. 23, no. 4, July 1992, p. 9-13.
Availability Source: Other Sources
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