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Polyimides Containing Amide And Perfluoroisopropyl LinksNew polyimides synthesized from reactions of aromatic hexafluoroisopropyl dianhydrides with asymmetric amide diamines. Soluble to extent of at least 10 percent by weight at temperature of about 25 degrees C in common amide solvents such as N-methylpyrrolidone, N,N-dimethylacetamide, and N,N-dimethylformamide. Polyimides form tough, flexible films, coatings, and moldings. Glass-transition temperatures ranged from 300 to 365 degrees C, and crystalline melting temperatures observed between 543 and 603 degrees C. Display excellent physical, chemical, and electrical properties. Useful as adhesives, laminating resins, fibers, coatings for electrical and decorative purposes, films, wire enamels, and molding compounds.
Document ID
19930000089
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Dezem, James F.
(NASA Langley Research Center, Hampton, VA.)
Date Acquired
August 16, 2013
Publication Date
February 1, 1993
Publication Information
Publication: NASA Tech Briefs
Volume: 17
Issue: 2
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
LAR-14608
Accession Number
93B10089
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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