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Indium Foil Serves As Thermally Conductive GasketIndium foil found useful as gasket to increase thermal conductance between bodies clamped together. Deforms to fill imperfections on mating surfaces. Used where maximum temperature in joint less than melting temperature of indium. Because of low melting temperature of indium, most useful in cryogenic applications.
Document ID
19930000328
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Eastman, G. Yale
(Thermacore, Inc.)
Dussinger, Peter M.
(Thermacore, Inc.)
Date Acquired
August 16, 2013
Publication Date
June 1, 1993
Publication Information
Publication: NASA Tech Briefs
Volume: 17
Issue: 6
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
MSC-21493
Accession Number
93B10328
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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