Thermographic characterization of stress during crack growth

A full-field-thermographic technique for imaging stress patterns in dynamically loaded structures using general purpose IR imaging and image processing hardware is described. The inspection technique is based on the thermoelastic effect. A simple geometry is examined, and the experimentally determined values for the stress invariant are shown to be consistent with theoretical and numerical calculations. The application of full-field-thermographic measurement would ensure that the observed stress field has a common sampling period, thus allowing the observation of rapidly occurring stress anomalies such as the propagation of a fatigue crack. Fatigue crack propagation in two consecutive thermoelastic stress images from an aluminum sample is shown.