Joining of materials with engineered interlayersA reliable method to join a variety of different materials is developed which uses engineered coatings to produce strong bonds by solid-state techniques at low temperatures (300-400 C). The strong bonds are capable of accommodating the strains created between Si and most substrates due to differences in thermal expansion coefficients. The approach encompasses two phases: noble metal compliant interlayers and functionally gradient interlayer bonding. Preliminary results are presented and the Ag interlayer bonds are microstructurally characterized confirming that the planar magnetron sputtered coatings/bonds are fully dense and metallurgically sound.
Document ID
19930036128
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Challenger, Kenneth D. (NASA Headquarters Washington, DC United States)
Cordea, Tom (NASA Headquarters Washington, DC United States)
Sengupta, Samit (NASA Headquarters Washington, DC United States)
Wampler, Scott (Cincinnati Univ. OH, United States)