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Vaporization heat transfer of dielectric liquids on a wick-covered surfaceVaporization heat transfer characteristics were measured for the dielectric liquid FC-72 on a horizontal heated surface covered with wire screen wicks with the mesh number for the screens varying from 24 to 100. In such a situation the liquid level can be either higher or lower than the heated surface. When the liquid level was above the heated surface (shallow pool boiling), the height of the liquid level above the surface, h, was varied from 0 to 10 mm. When the liquid level was below the heated surface (evaporation through capillary pumping), the distance from the liquid level to the edge of the surface, L, was adjusted from 0 to 15 mm. Experimental data revealed that the critical heat flux (CHF) decreases as the mesh number is increased from 24 to 100 for both vaporation and shallow pool boiling, showing that the vapor-escaping limit is more important than the capillary limit in flat plate heat pipe application.
Document ID
19930038689
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Gu, C. B.
(NASA Lewis Research Center Cleveland, OH, United States)
Chow, L. C.
(Kentucky Univ. Lexington, United States)
Baker, K.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
August 16, 2013
Publication Date
January 1, 1993
Subject Category
Fluid Mechanics And Heat Transfer
Report/Patent Number
AIAA PAPER 93-0283
Meeting Information
Meeting: AIAA, Aerospace Sciences Meeting and Exhibit
Location: Reno, NV
Country: United States
Start Date: January 11, 1993
End Date: January 14, 1993
Sponsors: AIAA
Accession Number
93A22686
Funding Number(s)
CONTRACT_GRANT: NAG3-1251
Distribution Limits
Public
Copyright
Other

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