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Record 49 of 963
Effect of HIPing on the effective thermal conductivity/diffusivity and the interfacial thermal conductance of uniaxial SiC fibre-reinforced RBSN
External Online Source: doi:10.1007/BF01165950
Author and Affiliation:
Bhatt, H.(NASA Lewis Research Center, Cleveland, OH, United States)
Donaldson, K. Y.(NASA Lewis Research Center, Cleveland, OH, United States)
Hasselman, D. P. H.(Virginia Polytechnic Inst. and State Univ., Blacksburg, United States)
Bhatt, R. T.(NASA Lewis Research Center, Cleveland, OH, United States)
Abstract: Hot isostatic pressing (HIPing) was found to increase the thermal diffusivity/conductivity of uniaxial silicon carbide fiber-reinforced reaction-bonded silicon nitride (RBSN) matrix composites, as the result of the densification of the matrix, the increase in the grain size of the silicon carbide and the improved thermal contact between the fibers and the matrix. Transverse to the fiber direction the thermal diffusivity/conductivity was found to be a function of the surrounding gaseous atmosphere due to the access of the gas phase to the fiber-matrix interface, which was facilitated by the existence of an interfacial gap due to the thermal expansion mismatch between the fibers and the matrix. The interfacial conductance was found to exhibit a strong positive temperature dependence as the result of the closure of the interfacial gap with increasing temperature.
Publication Date: Dec 15, 1992
Document ID:
19930042677
(Acquired Dec 28, 1995)
Accession Number: 93A26674
Subject Category: COMPOSITE MATERIALS
Document Type: Journal Article
Publication Information: Journal of Materials Science (ISSN 0022-2461); 27; 24; p. 6653-6661.
Publisher Information: United Kingdom
Financial Sponsor: NASA; United States
Organization Source: NASA Lewis Research Center; Cleveland, OH, United States
Description: 9p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: CERAMIC MATRIX COMPOSITES; HOT ISOSTATIC PRESSING; SILICON CARBIDES; SOLID-SOLID INTERFACES; THERMAL CONDUCTIVITY; THERMAL DIFFUSIVITY; FIBER-MATRIX INTERFACES; GRAIN SIZE; REACTION BONDING
Imprint And Other Notes: Journal of Materials Science vol. 27, no. 24 p. 6653-6661. Dec. 15, 1992
Availability Source: Other Sources
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