NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
A systems approach to solder joint fatigue in spacecraft electronic packagingDifferential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.
Document ID
19930058665
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Ross, R. G., Jr.
(JPL Pasadena, CA, United States)
Date Acquired
August 16, 2013
Publication Date
June 1, 1991
Publication Information
Publication: ASME, Transactions, Journal of Electronic Packaging
ISSN: 1043-7398
Subject Category
Quality Assurance And Reliability
Accession Number
93A42662
Distribution Limits
Public
Copyright
Other

Available Downloads

There are no available downloads for this record.
No Preview Available