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Investigation of etching techniques for superconductive Nb/Al-Al2O3/Nb fabrication processesWet etching, CF4 and SF6 reactive ion etching (RIE), RIE/wet hybrid etching, Cl-based RIE, ion milling, and liftoff techniques have been investigated for use in superconductive Nb/Al-Al2O3/Nb fabrication processes. High-quality superconductor-insulator-superconductor (SIS) junctions have been fabricated using a variety of these etching methods; however, each technique offers distinct tradeoffs for a given process an wafer design. In particular, it was shown that SF6 provides an excellent RIE chemistry for low-voltage anisotropic etching of Nb with high selectivity to Al. The SF6 tool has greatly improved the trilevel resist junction insulation process. Excellent repeatability, selectivity with respect to quartz, and submicron resolution make Cl2 + BCl3 + CHCl3 RIE a very attractive process for trilayer patterning.
Document ID
19930060673
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
External Source(s)
Authors
Lichtenberger, A. W.
(NASA Headquarters Washington, DC United States)
Lea, D. M.
(NASA Headquarters Washington, DC United States)
Lloyd, F. L.
(Virginia Univ. Charlottesville, United States)
Date Acquired
August 16, 2013
Publication Date
March 1, 1993
Publication Information
Publication: IEEE Transactions on Applied Superconductivity
Volume: 3
Issue: 1 pt
ISSN: 1051-8223
Subject Category
Electronics And Electrical Engineering
Accession Number
93A44670
Funding Number(s)
CONTRACT_GRANT: NAGW-2377
CONTRACT_GRANT: NSF AST-91-45270
Distribution Limits
Public
Copyright
Other

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