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Record Details

Record 49 of 36421
Metal-Ion Additives Reduce Thermal Expansion Of Polyimides
Author and Affiliation:
Stoakley, Diane M.(NASA Langley Research Center, Hampton, VA.)
St. Clair, Anne K.(NASA Langley Research Center, Hampton, VA.)
Emerson, Burt R., Jr.(NASA Langley Research Center, Hampton, VA.)
Willis, George L.(NASA Langley Research Center, Hampton, VA.)
Abstract: Polyimides widely used as high-performance polymers because of their excellent thermal stability and toughness. However, their coefficients of thermal expansion (CTE's) greater than those of metals, ceramics, and glasses. Decreasing CTE's of polyimides increase usefulness for aerospace and electronics applications in which dimensional stability required. Additives containing metal ions reduce coefficients of thermal expansion of polyimides. Reductions range from 11 to over 100 percent.
Publication Date: Apr 01, 1994
Document ID:
19940000208
(Acquired Dec 28, 1995)
Accession Number: 94B10208
Subject Category: MATERIALS
Report/Patent Number: LAR-14538
Document Type: NASA Tech Brief
Publication Information: NASA Tech Briefs (ISSN 0145-319X); 18; 4; P. 57
Publisher Information: United States
Financial Sponsor: NASA; United States
Organization Source: NASA Langley Research Center; Hampton, VA, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: No Copyright
NASA Terms: ADDITIVES; METAL IONS; POLYIMIDES; THERMAL EXPANSION
Availability Source: National Technology Transfer Center (NTTC), Wheeling, WV
Availability Notes: Additional information available through: National Technology Transfer Center (NTTC), Wheeling, WV 26003, (Tel: 1-800-678-6882).
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