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Modular Cooling ComponentsThree modular heat-transfer components designed for use together or separately. Simple mechanical connections facilitate assembly of these and related heat-transfer components into cooling systems of various configurations, such as to cool laboratory equipment rearranged for different experiments. Components are clamp-on cold plate, cold plate attached to flexible heat pipe, and thermal-bus receptacle. Clamp-on cold plate moved to any convenient location for attachment of equipment cooled by it, then clamped onto thermal bus. Heat from equipment conducted through plate and into coolant. Thermal-bus receptacle integral with thermal bus. Includes part of thermal bus to which clamp-on cold plate attached, plus tapered socket into which condenser end of flexible heat pipe plugged. Thermal-bus receptacle includes heat-pipe wick structure using coolant in bus to enhance transfer of heat from cold plate.
Document ID
19940000275
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Eastman, G. Yale
(Thermacore, Inc.)
Dussinger, Peter M.
(Thermacore, Inc.)
Hartenstine, John R.
(Thermacore, Inc.)
Date Acquired
August 16, 2013
Publication Date
May 1, 1994
Publication Information
Publication: NASA Tech Briefs
Volume: 18
Issue: 5
ISSN: 0145-319X
Subject Category
Mechanics
Report/Patent Number
MSC-21495
Accession Number
94B10275
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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