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Easily Processable High-Temperature PolyimidePolymerization without volatile gases leads to high-quality resins. N-CYCAP (amiNe substituted CYClophane Addition Polyimide) is thermoset polyimide developed containing 4-amino{2.2}paracyclophane as end cap. Current improvements in synthesis of end cap include increasing yield to 60 percent overall and decreasing manufacturing time by simplifying synthetic procedure. Enables large-scale production and increases viability of cyclophane end caps for polymers for high-temperature applications. In comparison with neat resin moldings and composite matrix resins made of PMR-II-50, those made of N-CYCAP polymers found to be processable with lower void content and higher thermo-oxidative stability.
Document ID
19940000335
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Sutter, James K.
(NASA Lewis Research Center, Cleveland, OH.)
Meador, Mary Ann
(NASA Lewis Research Center, Cleveland, OH.)
Meador, Michael A.
(NASA Lewis Research Center, Cleveland, OH.)
Waters, John F.
(Case Western Reserve Univ.)
Baldwin, Larry J.
(Ferro Corp.)
Date Acquired
August 16, 2013
Publication Date
June 1, 1994
Publication Information
Publication: NASA Tech Briefs
Volume: 18
Issue: 6
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
LEW-15611
Accession Number
94B10335
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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