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Polyimides containing amide and perfluoroisopropylidene connecting groupsNew, thermooxidatively stable polyimides were prepared from the reaction of aromatic dianhydrides containing isopropylidene bridging groups with aromatic diamines containing amide connecting groups between the rings. Several of these polyimides were shown to be semi-crystalline as evidenced by wide angle x ray scattering and differential scanning calorimetry. Most of the polyimides form tough, flexible films with high tensile properties. These polyimide films exhibit enhanced solubility in organic solvents.
Document ID
19940015901
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Dezern, James F.
(nasa) Hampton, VA, United States)
Date Acquired
August 16, 2013
Publication Date
September 7, 1993
Subject Category
Nonmetallic Materials
Accession Number
94N20374
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-5,243,023|NASA-CASE-LAR-14608-1
Patent Application
US-PATENT-APPL-SN-752246
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