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Poly(arylene ether imidazole) surfacing films for flat and parabolic structuresFilms of thermoplastic poly(arylene ether imidazole)s (PAEIs) are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to approximately -196 C.
Document ID
19950007726
Acquisition Source
Headquarters
Document Type
Other - Patent Application
Authors
Connell, John W.
(NASA Langley Research Center Hampton, VA, United States)
Towell, Timothy W.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 17, 2013
Publication Date
April 4, 1994
Subject Category
Nonmetallic Materials
Report/Patent Number
NAS 1.71:LAR-14812-1
Patent Number: NASA-CASE-LAR-14812-1
Patent Application Number: US-PATENT-APPL-SN-238102
Report Number: NAS 1.71:LAR-14812-1
Accession Number
95N14140
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LAR-14812-1
Patent Application
US-PATENT-APPL-SN-238102
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