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JTEC Panel report on microelectromechanical systems in JapanThis report summarizes recent activities in the development of microelectromechanical systems (MEMS) in Japan. For the purposes of this study, 'MEMS' means batch-fabricated miniature devices that convert physical parameters to or from electrical signals and that depend on mechanical structures or parameters in important ways for their operation. The report covers advanced materials and process technology; sensors and sensing microstructures; microactuators and actuation mechanisms; sensor-circuit integration and system partitioning; advanced packaging, microassembly, and testing technologies; and MEMS design techniques, applications, and infrastructure. The panel found that Japanese industry is emphasizing approaches to MEMS that are similar to those taken by U.S. industry (i.e., approaches based on silicon integrated-circuit technology); these efforts are comparable in their level of development to those in the United States. However, the ten-year, $250 million, MITI-sponsored program in micromachines emphasizes the miniaturization of more traditional (nonlithographic) machining processes, an area in which there is no comparable U.S. effort. Packaging technology and applications for batch-fabricated MEMS devices is considered a major challenge in both countries. The panel concluded that these and other issues will require global leadership and international cooperation to realize the benefits of MEMS in a timely way.
Document ID
19950021818
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Wise, Kensall D.
(Michigan Univ. Ann Arbor, MI., United States)
Muller, Richard S.
(California Univ. Berkeley, CA., United States)
Guckel, Henry
(Wisconsin Univ. Madison, WI., United States)
Giachino, Joseph M.
(Ford Motor Co. Dearborn, MI., United States)
Hocker, G. Benjamin
(Honeywell, Inc. Bloomington, MN., United States)
Jacobsen, Stephen C.
(Utah Univ. Salt Lake City, UT., United States)
Date Acquired
September 6, 2013
Publication Date
September 1, 1994
Publication Information
ISBN: 1-883-712-35-1
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
NAS 1.26:197831
NASA-CR-197831
PB95-100244
Accession Number
95N28239
Funding Number(s)
CONTRACT_GRANT: NSF ENG-92-17849
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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