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High-Temperature Graphite/Phenolic CompositeGraphite-fiber/phenolic-resin composite material retains relatively high strength and modulus of elasticity at temperatures as high as 1,000 degrees F. Costs only 5 to 20 percent as much as refractory materials. Fabrication composite includes curing process in which application of full autoclave pressure delayed until after phenolic resin gels. Curing process allows moisture to escape, so when composite subsequently heated in service, much less expansion of absorbed moisture and much less tendency toward delamination. Developed for nose cone of external fuel tank of Space Shuttle. Other potential aerospace applications for material include leading edges, parts of nozzles, parts of aircraft engines, and heat shields. Terrestrial and aerospace applications include structural firewalls and secondary structures in aircraft, spacecraft, and ships. Modified curing process adapted to composites of phenolic with other fiber reinforcements like glass or quartz. Useful as high-temperature circuit boards and electrical insulators.
Document ID
Document Type
Other - NASA Tech Brief
Seal, Ellis C.
(Martin Marietta Corp.)
Bodepudi, Venu P.
(Martin Marietta Corp.)
Biggs, Robert W., Jr.
(Martin Marietta Corp.)
Cranston, John A.
(Martin Marietta Corp.)
Date Acquired
August 17, 2013
Publication Date
March 1, 1995
Publication Information
Publication: NASA Tech Briefs
Volume: 19
Issue: 3
ISSN: 0145-319X
Subject Category
Report/Patent Number
Distribution Limits
Work of the US Gov. Public Use Permitted.
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