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Characterizing SOI Wafers By Use Of AOTF-PHIDevelopmental nondestructive method of characterizing layers of silicon-on-insulator (SOI) wafer involves combination of polarimetric hyperspectral imaging by use of acousto-optical tunable filters (AOTF-PHI) and computational resources for extracting pertinent data on SOI wafers from polarimetric hyperspectral images. Offers high spectral resolution and both ease and rapidity of optical-wavelength tuning. Further efforts to implement all of processing of polarimetric spectral image data in special-purpose hardware for sake of procesing speed. Enables characterization of SOI wafers in real time for online monitoring and adjustment of production. Also accelerates application of AOTF-PHI to other applications in which need for high-resolution spectral imaging, both with and without polarimetry.
Document ID
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Cheng, Li-Jen
Li, Guann-Pyng
(California Univ.)
Zang, Deyu
(Metro Laser, Inc.)
Date Acquired
August 17, 2013
Publication Date
June 1, 1995
Publication Information
Publication: NASA Tech Briefs
Volume: 19
Issue: 6
ISSN: 0145-319X
Subject Category
Physical Sciences
Report/Patent Number
Accession Number
Distribution Limits
Work of the US Gov. Public Use Permitted.

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