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High Flow Addition Curing PolyimidesA new series of high flow PMR-type addition curing polyimides was developed, which employed the substitution of 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (BTDB) for p-phenylenediamine (p -PDA) in a PMR-IL formulation. These thermoset polyimides, designated as 12F resins, were prepared from BTDB and the dimethyl ester of 4,4'- (hexafluo- roisopropylidene) -diphthalic acid (HFDE) with either nadic ester (NE) or p-aminostyrene (PAS) as the endcaps for addition curing. The 12F prepolymers displayed lower melting temperatures in DSC analysis, and higher melt flow in rheological studies than the cor- responding PMR-11 polyimides. Long-term isothermal aging studies showed that BTDB- based 12F resins exhibited comparable thermo-oxidative stability to P-PDA based PMR-11 polyimides. The noncoplanar 2- and 2'-disubstituted biphenyldiamine (BTDB) not only lowered the melt viscosities of 12F prepolymers, but also retained reasonable thermal sta- bility of the cured resins. The 12F polyimide resin with p-aminostyrene endcaps showed the best promise for long-term, high-temperature application at 343 C (650 F).
Document ID
19970032001
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Chuang, Kathy C.
(NASA Lewis Research Center Cleveland, OH United States)
Vannucci, Raymond D.
(NASA Lewis Research Center Cleveland, OH United States)
Ansari, Irfan
(Johns Hopkins Univ. Baltimore, MD United States)
Cerny, Lawrence L.
(Utica Coll. NY United States)
Scheiman, Daniel A.
(Sverdrup Technology, Inc. Brook Park, OH United States)
Date Acquired
August 17, 2013
Publication Date
January 1, 1994
Publication Information
Publication: Journal of Polymer Science: Part A: Polymer Chemistry
Publisher: John Wiley & Sons, Inc.
Volume: 32
ISSN: 0887-624X
Subject Category
Nonmetallic Materials
Report/Patent Number
E-7833
NASA-TM-112735
NAS 1.15:112735
Accession Number
97N72429
Distribution Limits
Public
Copyright
Public Use Permitted.
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