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Record Details

Record 33 of 6664
Preliminary reliability evaluation of flip chip on flex interconnect technology
Offline Availability: Go to Request Form
Author and Affiliation:
Shaw, Jack J.(NASA Goddard Space Flight Center, Greenbelt, MD United States)
Virmani, Naresh(Swales and Associates, Beltsville, MD United States)
Abstract: The study was carried out to evaluate the flip-chip-on-flex (FCOF) interconnection process in order to determine its feasibility for space flight applications. The key objectives were to: develop and apply simple and cost effective process steps needed to manufacture FCOFs and build test samples; perform a preliminary technology validation, and determine any initial environmental or application risks. The FCOF was shown to be simpler and more economical than other chip interconnection schemes.
Publication Date: Jul 01, 1997
Document ID:
19980033571
(Acquired May 02, 1998)
Subject Category: ELECTRONICS AND ELECTRICAL ENGINEERING
Document Type: Conference Paper
Publication Information: 205-212; (SEE 19980033541)
Publisher Information: International Organization
Financial Sponsor: NASA Goddard Space Flight Center; Greenbelt, MD United States
Organization Source: NASA Goddard Space Flight Center; Greenbelt, MD United States
Description: 8p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: No Copyright
NASA Terms: CHIPS (ELECTRONICS); MINIATURE ELECTRONIC EQUIPMENT; CIRCUIT RELIABILITY; CIRCUIT BOARDS; SPACECRAFT ELECTRONIC EQUIPMENT; FLEXIBLE BODIES; PERFORMANCE TESTS; TECHNOLOGY ASSESSMENT; COST EFFECTIVENESS
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