Measurement of Interfacial Undercooling in a Dilute Pb-Sn Alloy Near the Regime of Morphological Instability

The solid/liquid (s/1) interfacial Seebeck technique was used to measure interfacial undercooling in a Pb-1 wt.% Sn alloy. For plane front solidification an undercooling in the range of 0.54-0.57C was recorded. However, for growth velocities between 6 to 15 micron/s the undercooling, increased with increase in velocity. 'Tbis is in contradiction to the theoretical predictions based on growth at the extremum condition. A modified analytical expression was developed based on the maro,,inal stability criterion to predict undercooling for growth velocities immediately over the limit of morphological stability. Between 6 to 15 microns/s the trend predicted by this modified expression is in qualitative agreement with the experimental results. This model is more consistent with the analysis of Venugopal and Kirkaldy which states that the extremum condition criterion is not applicable in the marginal stability regime. At higher growth velocities between 20 and 50 microns/s where stable cellular growth is expected the undercooling, decreased with increase in velocity. The predictions of Burden and Hunt based on extremum criterion agree reasonably well with the experimental results in this velocity range. Finally, the importance of non-equilibrium phase diagram parameters such as partition coefficient and liquidus slope were also evaluated using the experimental undercooling results obtained in this investigation.