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Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC PackagesCoupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually Increases coupling between the lines: however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line.
Document ID
20010059872
Acquisition Source
Glenn Research Center
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Ponchak, George E.
(NASA Glenn Research Center Cleveland, OH United States)
Chun, Donghoon
(Michigan Univ. Ann Arbor, MI United States)
Yook, Jong-Gwan
(Kwang-Ju Inst. of Science and Technology Kwang-Ju Korea, Republic of)
Katehi, Linda P. B.
(Michigan Univ. Ann Arbor, MI United States)
Date Acquired
August 20, 2013
Publication Date
January 1, 2001
Publication Information
Publication: IEEE Transactions on Advanced Packaging
Publisher: Institute of Electrical and Electronics Engineers
Volume: 24
Issue: 1
ISSN: 1521-3323
Subject Category
Electronics And Electrical Engineering
Funding Number(s)
PROJECT: RTOP 755-08-0B
CONTRACT_GRANT: NSF CDA-92-14296
Distribution Limits
Public
Copyright
Other

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