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Alumina Encapsulated Strain Gage Not Mechanically Attached to the Substrate, Used to Temperature Compensate an Active High Temperature Gage in a Half-Bridge ConfigurationA temperature compensation element for a high-temperature strain gage and the method of fabricating the same. Preferably, the element is a "dummy" strain gage not mechanically attached to the substrate. The element is encapsulated in an insulative material and used to compensate an active high-temperature strain gage and wired in a half-bridge configuration. The temperature compensation element and high-temperature strain gage are fabricated using the method of the present invention. This method includes temporarily adhering the element to a heat sink, encapsulated in an insulative material and then removed from the heat sink. Next, the element is either stacked or placed near the active gage. Ideally, the element and the active gage have substantially similar heat transfer and electrical properties.
Document ID
20010111094
Acquisition Source
Armstrong Flight Research Center
Document Type
Other - Patent
External Source(s)
DRC-09607-4
Authors
Anthony Piazza
(Dryden Flight Research Center Rosamond, California, United States)
Date Acquired
August 20, 2013
Publication Date
October 16, 2001
Publication Information
Publisher: United States Patent and Trademark Office
Subject Category
Instrumentation And Photography
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-6,301,775
Patent Application
US-Patent-Appl-SN-252622
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