NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Thermal Property Measurement of Semiconductor Melt using Modified Laser Flash MethodThis study further developed standard laser flash method to measure multiple thermal properties of semiconductor melts. The modified method can determine thermal diffusivity, thermal conductivity, and specific heat capacity of the melt simultaneously. The transient heat transfer process in the melt and its quartz container was numerically studied in detail. A fitting procedure based on numerical simulation results and the least root-mean-square error fitting to the experimental data was used to extract the values of specific heat capacity, thermal conductivity and thermal diffusivity. This modified method is a step forward from the standard laser flash method, which is usually used to measure thermal diffusivity of solids. The result for tellurium (Te) at 873 K: specific heat capacity 300.2 Joules per kilogram K, thermal conductivity 3.50 Watts per meter K, thermal diffusivity 2.04 x 10(exp -6) square meters per second, are within the range reported in literature. The uncertainty analysis showed the quantitative effect of sample geometry, transient temperature measured, and the energy of the laser pulse.
Document ID
20030067820
Acquisition Source
Marshall Space Flight Center
Document Type
Conference Paper
Authors
Lin, Bochuan
(Alabama Univ. Birmingham, AL, United States)
Zhu, Shen
(NASA Marshall Space Flight Center Huntsville, AL, United States)
Ban, Heng
(Alabama Univ. Birmingham, AL, United States)
Li, Chao
(Alabama Univ. Birmingham, AL, United States)
Scripa, Rosalla N.
(Alabama Univ. Birmingham, AL, United States)
Su, Ching-Hua
(NASA Marshall Space Flight Center Huntsville, AL, United States)
Lehoczky, Sandor L.
(NASA Marshall Space Flight Center Huntsville, AL, United States)
Date Acquired
August 21, 2013
Publication Date
January 1, 2003
Subject Category
Lasers And Masers
Report/Patent Number
HT2003-40448
Meeting Information
Meeting: American Society of Mechanical Engineers Heat Transfer Conference
Location: Las Vegas, NV
Country: United States
Start Date: July 21, 2003
End Date: July 23, 2003
Sponsors: American Society of Mechanical Engineers
Funding Number(s)
CONTRACT_GRANT: NCC8-66
Distribution Limits
Public
Copyright
Other

Available Downloads

There are no available downloads for this record.
No Preview Available