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Effect of Assumed Damage and Location on the Delamination Onset Predictions for Skin-Stiffener DebondingThe difference in delamination onset predictions based on the type and location of the assumed initial damage are compared in a specimen consisting of a tapered flange laminate bonded to a skin laminate. From previous experimental work, the damage was identified to consist of a matrix crack in the top skin layer followed by a delamination between the top and second skin layer (+45 deg./-45 deg. interface). Two-dimensional finite elements analyses were performed for three different assumed flaws and the results show a considerable reduction in critical load if an initial delamination is assumed to be present, both under tension and bending loads. For a crack length corresponding to the peak in the strain energy release rate, the delamination onset load for an assumed initial flaw in the bondline is slightly higher than the critical load for delamination onset from an assumed skin matrix crack, both under tension and bending loads. As a result, assuming an initial flaw in the bondline is simpler while providing a critical load relatively close to the real case. For the configuration studied, a small delamination might form at a lower tension load than the critical load calculated for a 12.7 mm (0.5") delamination, but it would grow in a stable manner. For the bending case, assuming an initial flaw of 12.7 mm (0.5") is conservative, the crack would grow unstably.
Document ID
20040086059
Acquisition Source
Langley Research Center
Document Type
Other
Authors
Paris, Isabelle L.
(National Academy of Sciences - National Research Council Hampton, VA, United States)
Krueger, Ronald
(Institute for Computer Applications in Science and Engineering Hampton, VA, United States)
OBrien, T. Kevin
(Army Research Lab. Hampton, VA, United States)
Date Acquired
August 21, 2013
Publication Date
January 1, 2004
Subject Category
Aircraft Stability And Control
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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