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Layerwise Analysis of Thermal Shape Control in Graded Piezoelectric BeamsA layerwise finite element formulation developed for piezoelectric materials is used to investigate the displacement and stress response of a functionally graded piezoelectric bimorph actuator. The formulation is based on the principles of linear thermopiezoelectricity and accounts for the coupled mechanical, electrical, and thermal response of piezoelectric materials. The layerwise laminate theory is implemented into a linear beam element in order to provide a more accurate representation of the transverse and shear effects that are induced by increased inhomogeneities introduced through-the-thickness by using functionally graded materials. The accuracy of the formulation is verified with previously published experimental results for a piezoelectric bimorph actuator. Additional studies are conducted to analyze the impact of electric and thermal loads on the deflections and stresses in a bimorph actuator. Results of the study help demonstrate the capability of the layerwise theory to provide a more complete representation of shear effects that are no longer negligible even in thin piezoelectric beams. In addition, the effects of varying piezoelectric properties through-the-thickness of the beam are shown to provide additional benefits in minimizing the induced deformations and stresses.
Document ID
20040111958
Acquisition Source
Glenn Research Center
Document Type
Preprint (Draft being sent to journal)
Authors
Lee, Ho-Jun
(NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
August 21, 2013
Publication Date
January 1, 2003
Subject Category
Solid-State Physics
Report/Patent Number
IMECE-2003-41902
Meeting Information
Meeting: 2003 ASME International Mechanical Engineering Congress and Exposition
Location: Washington, DC
Country: United States
Start Date: November 16, 2003
End Date: November 21, 2003
Sponsors: American Society of Mechanical Engineers
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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