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Space Environmentally Durable Polyimides and CopolyimidesPolyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transition (T(sub g)) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides The polyimide materials can be processed into various material forms such as thin films, fibers, foams, threads, adhesive film, coatings, dry powders, and fiber coated prepreg, and uses include thin film membranes on antennas, second-surface mirrors, thermal optical coatings, and multilayer thermal insulation (MLI) blanket materials.
Document ID
20050167877
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
John W Connell
Joseph G Smith, Jr.
Paul M Hergenrother
Kent A Watson
Craig M Thompson
Date Acquired
August 23, 2013
Publication Date
January 11, 2005
Subject Category
Nonmetallic Materials
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-6,841,652
Patent Application
US-Patent-Appl-SN-095340
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