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Compression and Tensile Creep of Binary NiAlCompression creep and long term tensile creep studies were conducted on cast and extruded binary NiAl in the temperature range 700-1200 K with the objectives of characterizing and understanding the creep mechanisms. Inverse and normal primary creep curves were observed in both compression and tension creep depending on stress and temperature although an asymmetrical response was observed under these two stress states. It was concluded that the primary creep of NiAl is limited by dislocation mobility. The stress exponents, n, for compression and tensile creep were similar varying between about 5 and 14. However, there were significant differences in the stress dependence of the activation energies for compression and tensile creep. The true activation energy for tensile creep, Q(sub c), was constant and equal to about 400 kJ/mol between 20 and 50 MPa but decreased to a constant value of 250 kJ/mol between 50 and 110 MPa. The activation energy was observed to be inversely stress dependent above 110 MPa. In contrast, Q(sub c) = 300 kJ/mol for compression creep was constant between 25 and 70 MPa and inversely dependent on the true stress above 70 MPa. A detailed discussion of the probable dislocation creep mechanisms governing compressive and tensile creep of NiAl is presented. It is concluded that the non-conservative motion of jogs on screw dislocations influenced the nature of the primary creep curves, where the climb of these jogs involves either the next nearest neighbor or the six-jump cycle vacancy diffusion mechanism. The probable natures of the atom-vacancy exchange that occur within the core of an edge dislocation undergoing climb in NiAl are schematically examined.
Document ID
20050203798
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Raj, Sai V.
(NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
August 23, 2013
Publication Date
January 1, 2005
Subject Category
Metals And Metallic Materials
Meeting Information
Meeting: 2005 TMS Annual Meeting
Location: San Francisco, CA
Country: United States
Start Date: February 13, 2005
End Date: February 17, 2005
Sponsors: Minerals, Metals and Materials Society
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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