Packaging Considerations for Integrated RF Microphotonic Receiver at Ka-Band

The NASA Computing, Information and Communications Technology (CICT) Program is supporting the development of an RF microphotonic Ka-band receiver. The receiver consists of a lithium niobate micro-disk that enables the incoming RF signal (up to Ka-band) to be coupled to the optical signal (approx. 200 THz). The modulated optical signal is detected by the high-speed photonic signal processing electronics. When compared with an all-electronic approach, the microphotonic receiver technology offers 1 Ox smaller volume, smaller weight, and smaller power consumption, greater sensitivity, and optical isolation for applications in extreme environments. It could potentially be implemented to support planetary surface-to-surface and surface-to-relay communications, as well as high-data-rate inter-satellite links. We are currently studying a number of fabrication and integration issues that could result as this technology is advanced for potential insertion into a NASA mission. The results of our preliminary effort to integrate the RF microphotonic receiver components (e.g., the lithium niobate micro-disk, the optical elements, and the Ka-band patch antenna) on an etched silicon wafer will be presented, In addition, the concomitant integration and packaging issues, and the potential NASA applications will be discussed.