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2.45 GHz Rectenna Designed for Wireless Sensors Operating at 500 CHigh temperature wireless sensors that operate at 500 C are required for aircraft engine monitoring and performance improvement These sensors would replace currently used hard-wired sensors and lead to a substantial reduction in mass. However, even if the sensor output data is transmitted wirelessly to a receiver in the cooler part of the engine, and the associated cables are eliminated, DC power cables are still required to operate the sensors and power the wireless circuits. To solve this problem, NASA is developing a rectenna, a circuit that receives RF power and converts it to DC power. The rectenna would be integrated with the wireless sensor, and the RF transmitter that powers the rectenna would be located in the cooler part of the engine. In this way, no cables to or from the sensors are required. Rectennas haw been demonstrated at ambient room temperature, but to date, no high temperature rectennas haw been reported. In this paper, we report the first rectenna designed for 2.45 GHz operation at 500 C. The circuit consists of a microstrip dipole antenna, a stripline impedance matching circuit, and a stripline low pass filter to prevent transmission of higher harmonics created by the rectifying diode fabricated on an Alumina substrate. The rectifying diode is the gate to source junction of a 6H Sic MESFET and the capacitor and load resistor are chip elements that are each bonded to the Alumina substrate. Each element and the hybrid, rectenna circuit haw been characterized through 500 C.
Document ID
20050212128
Document Type
Preprint (Draft being sent to journal)
Authors
Ponchak, George E. (NASA Glenn Research Center Cleveland, OH, United States)
Schwartz, Zachary D. (NASA Glenn Research Center Cleveland, OH, United States)
Jordan, Jennifer L. (NASA Glenn Research Center Cleveland, OH, United States)
Downey, Alan N. (NASA Glenn Research Center Cleveland, OH, United States)
Neudeck, Philip G. (NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
August 23, 2013
Publication Date
January 1, 2004
Subject Category
Electronics and Electrical Engineering
Meeting Information
International Microelectronics and Packaging Society (IMAPS) International High Temperature Electronics Conference (HiTEC 2004)(Santa Fe, NM)
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.