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Packaging of microwave integrated circuits operating beyond 100 GHzSeveral methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5dB and return loss better than -17 dB from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split waveguide block packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe andantipodal finline.
Document ID
20060029849
Document Type
Conference Paper
External Source(s)
Authors
Samoska, L.
Daniel, E.
Sokolov, V.
Sommerfeldt, S.
Bublitz, J.
Olson, K.
Gilbert, B.
Chow, D.
Date Acquired
August 23, 2013
Publication Date
August 6, 2002
Subject Category
Electronics and Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
HEMT MMICS power amplifiers