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Reliability and paste process optimization of eutectic and lead-free for mixed packagingThis paper reports the results of an experiment that utilized the JPL's area array consortium test vehicle design, containing a myriad of mixed technology components with an OSP finish. The details of the reliability study are presented in this paper.
Document ID
20060029939
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Ramkumar, S. M.
Ganeshan, V.
Thenalur, K.
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
September 22, 2002
Distribution Limits
Public
Copyright
Other
Keywords
reliability AAR SMT
solder DOE ball grid array chip scale package BGA CSP eutectic leadfree

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