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Microelectronics packaging research directions for aerospace applicationsThe Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
Document ID
20060030419
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/10990
Authors
Galbraith, L.
Date Acquired
August 23, 2013
Publication Date
February 18, 2003
Distribution Limits
Public
Copyright
Other
Keywords
microelectronics reliability COTS PBGA HEMT MSFET PASM SIAP

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