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Record Details

Record 21 of 4748
Microelectronics packaging research directions for aerospace applications
External Online Source: hdl:2014/10990
Author and Affiliation:
Galbraith, L.
Abstract: The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
Publication Date: Feb 18, 2003
Document ID:
20060030419
(Acquired Sep 14, 2006)
Document Type: Conference Paper
Meeting Information: SMTA Pan Pacific Microelectronics Symposium; Maui, HI; United States
Financial Sponsor: Jet Propulsion Lab., California Inst. of Tech.; Pasadena, CA, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: AEROSPACE ENGINEERING; HIGH ELECTRON MOBILITY TRANSISTORS; MICROELECTRONICS; PACKAGING; RELIABILITY
Other Descriptors: MICROELECTRONICS RELIABILITY COTS PBGA HEMT MSFET PASM SIAP
Availability Source: Other Sources
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