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Reliability of CSP assemblies with underfill subjected to 4,000 extreme temperature cycles
Document ID
20060030998
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/12090
Authors
Ghafarian, R.
Date Acquired
August 23, 2013
Publication Date
May 8, 2002
Distribution Limits
Public
Copyright
Other
Keywords
chip scale package CSP area array package microvia thermal cycle solder joint
reliability

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