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Rapid qualification of area array package assemblies by increase of ramp rates and temperature ranges
Document ID
20060031006
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/12099
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
April 30, 2002
Distribution Limits
Public
Copyright
Other
Keywords
Chip scale package CSP area array package microvia thermal cycle solder joint
reliability water level package

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