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Thermal cycling test results of CSP and RF assembliesA JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Document ID
20060033166
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/15782
Authors
Ghaffarian, R.
Nelson, G.
Cooper, M.
Lam, D.
Strudler, S.
Umdekar, A.
Selk, K.
Bjorndahl, B.
Duprey, R.
Date Acquired
August 23, 2013
Publication Date
July 10, 2000
Distribution Limits
Public
Copyright
Other
Keywords
chip scale package CSP thermal cycle solder joint reliability

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