NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Dimpled Ball Grid Array process development for space flight applicationsThe 472 Dimpled Ball Grid Array (D-BGA) package has not been used in past space flight environments, therefore it is necessary to determine the robustness and reliability of the solder joints. The 472 D-BGA packages passed the above environmental tests within the specifications and are now qualified for use on space flight electronics.
Document ID
20060033565
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Barr, S. L.
Mehta, A.
Date Acquired
August 23, 2013
Publication Date
October 19, 2000
Distribution Limits
Public
Copyright
Other
Keywords
D-BGA Ball Grid Array qualification

Available Downloads

There are no available downloads for this record.
No Preview Available