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Accelerated thermal and mechanical testing of CSP assembliesChip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.
Document ID
20060033686
Document Type
Reprint (Version printed in journal)
External Source(s)
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
November 9, 2000
Publication Information
Publication: EEE Links
Distribution Limits
Public
Copyright
Other
Keywords
Chip Scale Package CSP thermal cycle fatigue solder joint reliability