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Accelerated Thermal Cycling and Failure MechanismsThis paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.
Document ID
20060033871
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
June 13, 1999
Distribution Limits
Public
Copyright
Other
Keywords
BGA CSP CBGA thermal cycle solder joint reliability

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