NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
Chip Scale Package Implementation IssuesAvailability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
Document ID
20060034017
Acquisition Source
Jet Propulsion Laboratory
Document Type
Reprint (Version printed in journal)
External Source(s)
hdl:2014/17353
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
January 1, 1999
Publication Information
Publication: Semiconductor FabTech.
Distribution Limits
Public
Copyright
Other
Keywords
CSP Solder Joint Reliability

Available Downloads

There are no available downloads for this record.

Related Records

There are no records associated with this record.
No Preview Available