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CSP Reliability for Single-and Double-Sided AssembliesThis paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).
Document ID
20060034175
Acquisition Source
Jet Propulsion Laboratory
Document Type
Reprint (Version printed in journal)
External Source(s)
hdl:2014/17906
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
October 1, 1999
Publication Information
Publication: Chip Scale Review Magazine
Distribution Limits
Public
Copyright
Other
Keywords
CSP chip scale package thermal cycle solder joint reliability double side

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