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Shock and Thermal Cycling Synergism Effects on Reliability of CBGA AssembliesBall Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace.
Document ID
20060034551
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/18836
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
March 18, 1999
Distribution Limits
Public
Copyright
Other
Keywords
CBGA Ceramic Ball Grid Array solder joint reliability vibration

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