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Chip Scale Package Joint Integrity of CSP under Isothermal AgingThe popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
Document ID
20060034639
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
May 6, 1998
Distribution Limits
Public
Copyright
Other
Keywords
Chip Scale Packages (CSPs) Microtype BGA SEM

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