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CSP, BGA, and SM Packages for Harsh Environmental ApplicationsDifferent aspects of advanced surface mount package technology have been investigated for aerospace applications.
Document ID
20060035451
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
December 2, 1997
Distribution Limits
Public
Copyright
Other
Keywords
SMA reliability BGA Packages Asembly Reliability CSP Assembly Reliability

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