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Reliability Investigation of Ball Grid Array Assemblies for Space Flight ApplicationsJPL, in a partnership with an industrial consortium, is currently engaged in the investigation of reliability and quality issues if ball grid array (BGA) packages as they may be applied to space flight electronics. Performing tests to determine the solder joint reliability of assemblies using BGAs under temperature cycling has proved to be a real challenge for test engineers.
Document ID
20060036795
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Bonner, D. K.
Walton, S.
Date Acquired
August 23, 2013
Publication Date
February 23, 1997
Distribution Limits
Public
Copyright
Other
Keywords
Ball grid array printed wiring assemblies reliability solder joint

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