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Case Studies in Continuous Process ImprovementThis study focuses on improving the SMT assembly process in a low-volume, high-reliability environment with emphasis on fine pitch and BGA packages. Before a process improvement is carried out, it is important to evaluate where the process stands in terms of process capability.
Document ID
20060036869
Document Type
Conference Paper
External Source(s)
Authors
Mehta, A.
Date Acquired
August 23, 2013
Publication Date
February 25, 1997
Distribution Limits
Public
Copyright
Other
Keywords
SMT BGA process improvement